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Анри Пуанкаре, 1854 год

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС: Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics: Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком: Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц: Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника. 23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083: Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Итоги выставки ExpoElectronica 2026: ключевые тренды и новинки РУ Электроникс: Компания РУ Электроникс приняла участие в 28-й международной выставке ExpoElectronica 2026 которая традиционно является ключевым отраслевым событием в сфере электронной промышленности. В рамках масштабной экспозиции был представлен широкий спектр линеек электронных компонентов RUICH I включая разъёмы дисплеи устройства коммутации клеммники конденсаторы тиристоры и многие другие.… 21-04-2026

Итоги выставки ExpoElectronica 2026: Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

Recycling PLA and Other Plastic Waste with Compression Molding: After previously trying out low-tech compression molding with a toaster oven and 3D printed molds future things is back with a video that seeks to explore some of the questions read… 29-04-2026

The Top Ten Most Popular Of The Royal Society s Papers: Thanks to the Royal Society for this one the ten most popular papers it published last year: 10. Herring gulls tune in to human voices This Biology Letters ... The post The Top Ten Most Popular Of The Royal Society s Papers appeared first on Electronics Weekly… 29-04-2026

Build4Asia Returns this May Elevating the Roles of Facility Management and Fire Safety Within the Built Environment: Build4Asia returns 6 8 May at the Hong Kong Convention and Exhibition Center bringing renewed energy and bold new ambitions to the industry. The post Build4Asia Returns this May Elevating the Roles of Facility Management and Fire Safety Within the Built Environment appeared first on EDN Asia… 29-04-2026

Can you 3D Print a Pinball Machine That s Fun to Play: It seems fair to say that pinball machines are among the most universally loved gaming systems known today yet the full-sized ones are both very expensive and very large while read… 29-04-2026

Payphone Tag Is Australia s New National Sport: Australia s payphones are an iconic part of the national landscape even if they re not as important as they once used to be. However they re having a resurgence of late in read… 28-04-2026

2026 Green Powered Challenge: Supercapacitor Enables High-Power IoT: With all the battery technologies and modern low-current sleep modes in most microcontrollers running a sensor and microcontroller combo off-grid and far away from any infrastructure is usually not too read… 28-04-2026

Hackaday Europe: Last Round of Speakers Workshops: If you don t already have your tickets to Hackaday Europe pick them up now. The clock is ticking Today we d like to announce our keynote speaker the remainder of our read… 28-04-2026

Microarchitecture Tailored to 3D-Stacked Near-Memory Processing LLM Decoding U. of Edinburgh Peking U. Cambridge et al.: A new technical paper Rethinking Compute Substrates for 3D-Stacked Near-Memory LLM Decoding: Microarchitecture-Scheduling Co-Design was published by researchers at University of Edinburgh Peking University University of Cambridge University of Chinese Academy of Sciences and the Hong Kong University of Science and Technology. Abstract Large language model LLM decoding is a major… 28-04-2026

Rethinking ESD Protection for System-On-Integrated Chiplets UC Riverside: A new technical paper In-SoIC ESD Protection for Chiplet-Based 3D Microsystems: Future Research Directions was published by researchers at the University of California Riverside. Abstract Heterogeneous integration opens a pathway to three-dimensional chiplet-based microsystem chips. Electrostatic discharge reliability is a major challenge to future smart chips featuring rich functionalities 28-04-2026

Alumina Nanowires Improve Thermal Management in Advanced Packaging Georgia Tech et al.: A new technical paper Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract The rapid increase in heat flux in advanced 2.5D/3D semiconductor packaging places stringent demands on thermal interface materials… 28-04-2026

Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures TU Munich: A new technical paper Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures was published by researchers at the Technical University of Munich. Abstract As quantum computing advances toward fault-tolerance through quantum error correction modular chiplet architectures have emerged to provide the massive qubit counts required while overcoming fabrication limits of monolithic… 28-04-2026

Leveraging Agentic AI Techniques to Improve Formal Verification Infineon et al.: A new technical paper Agentic AI-based Coverage Closure for Formal Verification was published by researchers at Infineon and the NIT Jalandhar. Abstract Coverage closure is a critical requirement in Integrated Chip IC development process and key metric for verification sign-off. However traditional exhaustive approaches often fail to achieve full coverage within project timelines. This… 28-04-2026

Reflectometry-Based Technique for Characterising Complex Thin-Film Structures Aalto U. et al.: A new technical paper Characterisation of Complex Multilayer Nanostructures with High Aspect Ratio was recent published by researchers at Aalto University University of Eastern Finland Chipmetrics OY and VTT MIKES. Abstract Deposition studies of deep vertical dips on semiconductor wafers can create problems at an industrial manufacturing scale since cross-sectioning requires a lot… 28-04-2026

A Tube Amplifier That s Oven Ready: The problem with tube based audio is that it has so often been hijacked by people for whom the bragging rights of having a tube amplifier outweigh the benefits or read… 28-04-2026

The system architect s sketchbook: The tree knows: Great systems like great trees know what they need. The post The system architect s sketchbook: The tree knows appeared first on… 28-04-2026

The GPS III Rollout is Almost Complete But What is it: Considering how integral it is to our modern way of life you could be excused for thinking that the Global Positioning System GPS is a product of the smartphone era. read… 28-04-2026