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Итоги выставки Газ. Нефть. Технологии - 2026 Итоги выставки Газ. Нефть. Технологии - 2026
С 26 по 29 мая 2026 года компания Теллур Электроникс приняла участие в международной выставке Газ. Нефть. Технологии 2026 которая прошла в Уфе и традиционно собрала ведущих представителей нефтегазовой отрасли промышленности и приборостроения. В течение четырех дней специалисты компании проводили встречи с действующими и потенциальными партнерами обсуждали актуальные задачи предприятий… 04-06-2026
Модуль охлаждения полупроводников от A-MEC
A-MEC представляет модуль охлаждения полупроводников оснащённый двумя алюминиевыми радиаторами и двумя вентиляторами. 03-06-2026
Герметичные разъёмы ZH28 аналоги СНЦ28 Герметичные разъёмы ZH28 аналоги СНЦ28
Компания Теллур Электроникс начала поставки герметичных цилиндрических соединителей ZH28. Данные разъёмы фиксируются квадратным фланцем на приборную панель под 4 винта и имеют изолятор из стеклянного спая. Являются аналогом российской серии СНЦ28. Аналог ZH28 Российский артикул СНЦ28 ZH28-10/18B-1-b-B СНЦ28-10/18В-1-б-В ZH28-10/18B-1-B СНЦ28-10/18В-1-В ZH28-10/22B-1-b-B СНЦ28-10/22В-1-б-В… 02-06-2026
Официальный сайт Neditek полностью обновлён: новая структура новые каталоги и раздел о качестве
Компания Neditek NEDI Technology Co. Ltd. в апреле 2026 запустила полностью новую версию официального сайта. 01-06-2026
Коннекторы до 500 C и 200 МПа для геофизического оборудования от Sunkye
Sunkye разработала специальные версии высокотемпературных соединителей для работы при температуре до… 28-05-2026
4-канальный приемопередающий модуль трансивера X-диапазона от Hisiwell
Компания Hisiwell представляет SiP-трансивер System in Package transceiver с четырьмя независимыми радиочастотными каналами X-диапазона модуль HX9X40210G20. 27-05-2026
Квантово-каскадные лазеры Фабри-Перо от Thorlabs
Компания Thorlabs анонсировала квантово-каскадный лазер Фабри-Перо… 26-05-2026
Navitas introduces isolated through-hole package for 1200-3300V SiC MOSFETs
Gallium nitride GaN power IC and silicon carbide SiC technology firm Navitas Semiconductor Corp of Torrance CA USA has launched its new UHV TO 247 4 ISO package setting what is claimed to be a new benchmark for high performance discrete power… 09-06-2026
Automatic Tutorial Generator is Perhaps the Best-Case For Vibe Coding Automatic Tutorial Generator is Perhaps the Best-Case For Vibe Coding
Quick question: how did you learn to code It probably wasn t bribing someone a year or two ahead of you in CS to finish all your homework but that s exactly read… 09-06-2026
High-Isolation Gate Drive Converters from Murata Support Safer Faster Switching in High-Voltage Applications for Energy Storage Motor Drives and Industrial Automation
Murata introduces its MGJ1T series a new range of 6kVDC isolated 1W surface-mount DC-DC converters. 09-06-2026
WIN s 0.12µm GaN power process qualified for 40V operation
WIN Semiconductors Corp of Taoyuan City Taiwan which provides pure-play gallium arsenide GaAs and gallium nitride GaN wafer foundry services for the wireless infrastructure and networking markets says that its NP12-0B process has been qualified for 40V operation... 09-06-2026
AI Models Transform Defect Inspection And Review But Can Fail To Scale
Majority of AI initiatives failing synthetic data gaining traction due to limited real-world data. The post AI Models Transform Defect Inspection And Review But Can Fail To Scale appeared first on Semiconductor Engineering… 09-06-2026
What I Learned At The 2026 GSA Tech Summit: The Future Of Semiconductor Collaboration Is Full Stack
Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain. The post What I Learned At The 2026 GSA Tech Summit: The Future Of Semiconductor Collaboration Is Full Stack appeared first on Semiconductor Engineering… 09-06-2026
Effective UX/UI Is A Critical Link Between AI Insights And Yield Improvement
AI must operate as a verifiable engineering collaborator where outputs are transparent traceable and subject to human interpretation and refinement. The post Effective UX/UI Is A Critical Link Between AI Insights And Yield Improvement appeared first on Semiconductor Engineering… 09-06-2026
High-Speed Manufacturing And In-Field Scan Test Access Via PCI Express For GPIO Limited SoCs
Enabling faster more scalable and lifecycle-wide testing while conserving limited pins. The post High-Speed Manufacturing And In-Field Scan Test Access Via PCI Express For GPIO Limited SoCs appeared first on Semiconductor Engineering… 09-06-2026
Why Analog And Mixed-Signal Chips Resist Adaptive Test
Analog behavior is difficult to compress into simple pass/fail decisions that could reduce redundant coverage. The post Why Analog And Mixed-Signal Chips Resist Adaptive Test appeared first on Semiconductor Engineering… 09-06-2026
Co-Packaged Optics Testing Faces Steep Data Center Ramp
Scaling to tens of millions of CPO units per year requires the industry to first settle on automated cost-effective methods for electrical and optical testing. The post Co-Packaged Optics Testing Faces Steep Data Center Ramp appeared first on Semiconductor Engineering… 09-06-2026
Enhancing High Bandwidth Memory HBM Reliability With 3D X-ray Inspection
A non-destructive volumetric view enables engineers to detect defects that could compromise performance or reliability. The post Enhancing High Bandwidth Memory HBM Reliability With 3D X-ray Inspection appeared first on Semiconductor Engineering… 09-06-2026
Test Anything Anywhere Anytime
In-field testing is essential for quickly detecting emerging defects throughout a device s operational lifespan. The post Test Anything Anywhere Anytime appeared first on Semiconductor Engineering… 09-06-2026
Advancements in Corona Noncontact Metrology Tools CnCV for Industrial WBG Wafer Testing and Electrical Defect Related Yield Prediction
Metrology for defect screening yield learning and process control in WBG manufacturing. The post Advancements in Corona Noncontact Metrology Tools CnCV for Industrial WBG Wafer Testing and Electrical Defect Related Yield Prediction appeared first on Semiconductor Engineering… 09-06-2026
2026 ASMC - Building the Core Pillars for AI in Semiconductors
A roadmap for operationalizing AI at scale and achieving sustained competitive advantage across the semiconductor lifecycle. The post 2026 ASMC Building the Core Pillars for AI in Semiconductors appeared first on Semiconductor Engineering… 09-06-2026
As Chips Go Vertical Metrology Struggles to Keep Up
Chip technology dives deeper into the Z-axis pushing metrology to innovate or risk becoming a bottleneck. The post As Chips Go Vertical Metrology Struggles to Keep Up appeared first on EE Times… 09-06-2026
Roll up for the Elon Show
The SpaceX IPO on Friday is already 2x oversubscribed reports Reuter s with 150 billion offered for shares costing 75 billion in an enterprise valued at 1.8 trillion.. It is seen ... The post Roll up for the Elon Show appeared first on Electronics Weekly… 09-06-2026