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Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

SDR модули CR-P047/CR-P047P от Cruetech

Макро Групп предлагает SDR модули CR-P047 и CR-P047P под брендом… 20-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем

Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%

Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

Автомобильный дискретный IGBT на 1200 В от Sunco

Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics

Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс

Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

  Treat the Antenna Gap as Design Space Not Wasted Space. - Dr K. Mithra

As 5G networks densify and massive MIMO scales antenna engineers face persistent mutual coupling in compact arrays. Dr K. Mithra   an Arizona-based independent wireless researcher and inventor explains to EFY s Akanksha Sondhi Gaur how reengineering the inter-element gap rather than increasing spacing. Q. What inspired you to focus on mutual coupling reduction in microstrip… 21-04-2026

Faster Way to Finish Chip Design

A chip design approach brings heat power and signal checks earlier in the process helping find issues reduce rework and improve performance and reliability. Synopsys has introduced Multiphysics Fusion technology bringing Ansys golden multiphysics engines into its EDA tools to address chip design issues linked to electromagnetics thermal and mechanical effects. The first… 21-04-2026

AI optical transceiver market up 57% YoY

The  global market for AI-focused optical transceivers grew 57% last year  from 16.5 billion in 2025 to 26 billion in 2026 says TrendForce. Demand is rising sharply for 800G and ... The post AI optical transceiver market up 57% YoY appeared first on Electronics Weekly… 21-04-2026

Cyberdeck Build Gets Closer To Regular Laptop Than Most

Cyberdecks are typically reminiscent of weird computers in futuristic sci-fi films moreso than the computers of today. The cool thing about cyberdecks though is you get to build them however read… 21-04-2026

Designing a Digital-controlled PFC

Digital-controlled PFC improves efficiency reduces THD and enables advanced control in totem-pole AC/DC power supplies systems. The post Designing a Digital-controlled PFC appeared first on EDN Asia… 21-04-2026

Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year

Infineon leads the automotive semiconductor market in 2025 extending its dominance across regions and MCU segment growth globally. The post Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year appeared first on EDN Asia… 21-04-2026

Cadence and Google Partner to Scale AI-driven Chip Design

The integration of Google s Gemini models with Cadence ChipStack AI Super Agent accelerates next-generation agent-driven design automation. The post Cadence and Google Partner to Scale AI-driven Chip Design appeared first on EDN Asia… 21-04-2026

Growing Aluminium-Copper Alloy Crystals Using Hydrogen

Having molten aluminium interact with atmospheric water forms a source of hydrogen which can be rather problematic if you re trying to cast aluminium parts. As the molten metal cools down read… 21-04-2026

Murata to Showcase Advanced Sensors and Connectivity Innovation at Sensors Converge 2026

Murata a global leader in advanced electronics will exhibit its latest innovations in sensing connectivity and intelligent systems design at Sensors Converge 2026 held May 5-7 in Santa Clara California. 21-04-2026

ROHM Develops 5th Generation SiC MOSFETs with Approx. 30% Lower On-Resistance at High Temperatures

April 21st 2026 ROHM has developed the latest device of its EcoSiC series: the 5th Generation SiC MOSFETs optimized for high efficiency power applications. This technology is ideally suitable for automotive electric powertrain systems such as traction inverters for electric vehicles xEVs as well as power supplies for AI servers and industrial equipment such as data centers. In recent… 21-04-2026

Molex to Acquire Teramount

Molex is accelerating adoption of scalable co-packaged optics deployment for AI infrastructure by acquiring Teramount. The post Molex to Acquire Teramount appeared first on EDN Asia… 21-04-2026

Artilux Unveils Hybrid Optoelectronic Architecture for Next-Gen AI Computing

Artilux Inception delivers significant improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling. The post Artilux Unveils Hybrid Optoelectronic Architecture for Next-Gen AI Computing appeared first on EDN Asia… 21-04-2026

Teradyne Acquires TestInsight

Teradyne Inc. is strengthening its ability to support customer design-in activities and accelerate time to market for the emerging AI and data center markets by acquiring TestInsight a leading provider of semiconductor test development validation and conversion software widely used across the industry. TestInsight s advanced tools and expert team will be pivotal in accelerating the … 21-04-2026

Tim Cook to step down as Apple CEO

Tim Cook will step down as CEO of Apple at the end of August Apple has announced. Senior vice president of Hardware Engineering John Ternus will become CEO on 1 ... The post Tim Cook to step down as Apple CEO appeared first on Electronics Weekly… 21-04-2026

Making the Most Pick-Proof Lock Yet

Throughout the centuries the art of lock-making and lock-picking have been trapped in a constant struggle with basic lock designs being replaced by ever more complex ones that seek to read… 21-04-2026

Vintage Chyron TV Hardware Of course It Runs NetBSD

Perhaps at this point getting NetBSD running on an obscure piece of hardware is a dog-bites-man story and not worth reporting their motto after all is Of course it runs read… 20-04-2026