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SiC MOSFET на 1200 В 75 А 30 мОм в корпусе TOLT с верхним отводом тепла от AMG Power: AMG Power анонсировал производства карбид-кремниевых МОП-транзисторов транзисторов на 1200 В с сопротивлением 30 мОм в корпусе TOLT с отводом тепла через верхнюю поверхность. 26-03-2026

Приглашаем на выставку ЭкспоЭлектроника-2026: Приглашаем посетить наш стенд компании Макро Групп на выставке ЭкспоЭлектроника-2026… 25-03-2026

Многоканальные паяльные станции Актаком доступны к поставке: Информируем о доступности поставки с короткими сроками широкого ассортимента многоканальных паяльных станций - ремонтных комплексов Актаком различного функционального назначения. 24-03-2026

Высокомощные разъёмы стандарта OCP M-CRPS от Oupiin: Компания Oupiin представила высокомощных разъёмов соответствующие стандарту OCP M-CRPS серию… 23-03-2026

Преобразователи уровня К5017ПУ от АО НЗПП Восток: Серия К5017ПУ разработанная и производимая АО НЗПП Восток представляет собой линейку современных двунаправленных преобразователей логических уровней предназначенных для согласования цифровых сигналов между микросхемами и устройствами работающими при разных напряжениях. Микросхемы позволяют безопасно и эффективно устанавливать соединения между цифровыми устройствами что критически важно… 20-03-2026

Мотореле A-MEC: A-MEC представил мотореле с возможностью переключения тока и напряжения 100 А/250 В AC MR02-100… 20-03-2026

Приглашаем на выставку ExpoElectronica 2026: Рады сообщить что компания РУ Электроникс станет участником международной выставки электроники ExpoElectronica 2026 . Ждем вас с 14 по 16 апреля в Москве на крупнейшем отраслевом событии в России и ЕАЭС чтобы обсудить новинки текущие проекты и перспективы сотрудничества. Выставка пройдет в Москве в МВЦ Крокус Экспо . Получить билет на выставку. Что ждет вас на выставке ExpoElectronica … 19-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech: Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

Motor-Free Actuator for Fast Motion: This actuator skips motors and still moves in under a second bending and returning on its own pointing to new ways to build robotic and space systems. A smart material-based actuator developed at KAIST operates in less than a second without using a motor offering a new option for robotics and space structures that… 26-03-2026

Catalyst That Could Change Fuel Cells Forever: A nickel catalyst defies precious metals unlocking high-performance fuel cells that could transform energy for vehicles generators and remote power systems. Researchers at Cornell University have developed a nickel-based catalyst that enables high-performance fuel cells without relying on precious metals. Designed for alkaline environments the catalyst maintains strong hydrogen oxidation… 26-03-2026

Cracking the Code of Next-Gen Batteries: Researchers reveal how tiny metallic dendrites sabotage solid-state batteries and uncover a path to safer energy-dense power for advancing devices. MIT researchers have uncovered why solid-state batteries long hailed as safer and more energy-dense alternatives to lithium-ion are prone to short-circuiting. Using a novel visualization technique the team directly observed metallic dendrites… 26-03-2026

Platform Powering the Brain-Inspired Revolution: A unified platform that can bring spiking neural networks together accelerating neuromorphic AI from fragmented research to real-world edge deployment. Innatera has introduced Synfire an open community driven platform designed to unify the neuromorphic computing ecosystem and accelerate real world edge AI deployment. The platform addresses fragmentation across tools models and deployment… 26-03-2026

High-speed storage for digital creators: Have you faced storage issues while working with large files or running AI models locally This storage helps keep work running and avoids delays. Team Group Inc. has introduced the T-CREATE CLASSIC H514 M.2 PCIe 5.0 SSD to address demand for data storage in the generative AI era. Built on the PCIe Gen5… 26-03-2026

Ultrasonic Welding System Expands Power Assembly: A welding system that can remove heat consumables and process complexity enabling cleaner manufacturing and evolving power module designs. Kulicke Soffa has introduced ASTERION-TW an ultrasonic terminal welding system designed for next generation power module manufacturing. The system brings solid-state ultrasonic welding as an alternative to conventional mass-reflow processes targeting… 26-03-2026

The 6G clock ticking: Why silicon architecture for 2030 must start in 2026: While 6G is anticipated to take off commercially by 2030 the work-back schedule reveals a tight timeline for wireless developers. The post The 6G clock ticking: Why silicon architecture for 2030 must start in 2026 appeared first on… 26-03-2026

AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric: Inference is reshaping data center architecture introducing a new and less forgiving set of network requirements. The post AI Workloads Are Turning The Data Center Network Into A Combined Memory And Storage Fabric appeared first on Semiconductor Engineering… 26-03-2026

IP Requirements Evolve For 3D Multi-Die Designs: Vertical signal paths create complex parasitic interactions that are harder to model and control. The post IP Requirements Evolve For 3D Multi-Die Designs appeared first on Semiconductor Engineering… 26-03-2026

Importance Of Hardware Security Verification In Pre-Silicon Design: As hardware systems grow in complexity security can no longer rely on assumptions or isolated checks. The post Importance Of Hardware Security Verification In Pre-Silicon Design appeared first on Semiconductor Engineering… 26-03-2026

Memory Wall Gets Higher: With SRAM failing to scale in recent process nodes the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon. The post Memory Wall Gets Higher appeared first on Semiconductor Engineering… 26-03-2026

Precision In Depth: Extraction Workflows For CFETs And Buried Power Rails: Robust extraction empowers semiconductor innovation at the most complex nodes. The post Precision In Depth: Extraction Workflows For CFETs And Buried Power Rails appeared first on Semiconductor Engineering… 26-03-2026

Shift Verification Left: AI Tools For Faster Smarter Chip Design: If designers can verify individual blocks before subsystem integration the verification team can focus on complex system-level interactions. The post Shift Verification Left: AI Tools For Faster Smarter Chip Design appeared first on Semiconductor Engineering… 26-03-2026

Data Boom Puts Pressure On NoCs Fabrics: New adaptive mesh NoC topologies are enabling chip designers to optimize data movement in complex SoCs and multi-die systems. The post Data Boom Puts Pressure On NoCs Fabrics appeared first on Semiconductor Engineering… 26-03-2026

Detect Diagnose And Debug Using Sensors And Functional Monitoring: Observe and correlate changes in the physical power delivery network with functional behavior. The post Detect Diagnose And Debug Using Sensors And Functional Monitoring appeared first on Semiconductor Engineering… 26-03-2026

Removing The Accuracy And Time Tradeoff In EM Simulation: Massively parallel GPU execution allows large FEM matrix systems to run efficiently. The post Removing The Accuracy And Time Tradeoff In EM Simulation appeared first on Semiconductor Engineering… 26-03-2026