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Итоги выставки Газ. Нефть. Технологии - 2026

С 26 по 29 мая 2026 года компания Теллур Электроникс приняла участие в международной выставке Газ. Нефть. Технологии 2026 которая прошла в Уфе и традиционно собрала ведущих представителей нефтегазовой отрасли промышленности и приборостроения. В течение четырех дней специалисты компании проводили встречи с действующими и потенциальными партнерами обсуждали актуальные задачи предприятий… 04-06-2026

Модуль охлаждения полупроводников от A-MEC

A-MEC представляет модуль охлаждения полупроводников оснащённый двумя алюминиевыми радиаторами и двумя вентиляторами. 03-06-2026

Герметичные разъёмы ZH28 аналоги СНЦ28

Компания Теллур Электроникс начала поставки герметичных цилиндрических соединителей ZH28. Данные разъёмы фиксируются квадратным фланцем на приборную панель под 4 винта и имеют изолятор из стеклянного спая. Являются аналогом российской серии СНЦ28. Аналог ZH28 Российский артикул СНЦ28 ZH28-10/18B-1-b-B СНЦ28-10/18В-1-б-В ZH28-10/18B-1-B СНЦ28-10/18В-1-В ZH28-10/22B-1-b-B СНЦ28-10/22В-1-б-В… 02-06-2026

Официальный сайт Neditek полностью обновлён: новая структура новые каталоги и раздел о качестве

Компания Neditek NEDI Technology Co. Ltd. в апреле 2026 запустила полностью новую версию официального сайта. 01-06-2026

Коннекторы до 500 C и 200 МПа для геофизического оборудования от Sunkye

Sunkye разработала специальные версии высокотемпературных соединителей для работы при температуре до… 28-05-2026

4-канальный приемопередающий модуль трансивера X-диапазона от Hisiwell

Компания Hisiwell представляет SiP-трансивер System in Package transceiver с четырьмя независимыми радиочастотными каналами X-диапазона модуль HX9X40210G20. 27-05-2026

Квантово-каскадные лазеры Фабри-Перо от Thorlabs

Компания Thorlabs анонсировала квантово-каскадный лазер Фабри-Перо… 26-05-2026

ROHM s 750V SiC MOSFET adopted in battery backup unit for AI servers

ROHM says that its 750V silicon carbide SiC MOSFET has been adopted in a BBU battery backup unit for AI server power supplies. With the rise of generative AI AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC high-voltage direct current architectures. In this environment ROHM s device was selected as a SiC power device that supports next-generation… 04-06-2026

Indium Corp and Ames National Lab team to establish US gallium supply chain

Indium Corp of Clinton NY USA a supplier of refined gallium germanium indium and other specialty technology metals and Ames National Laboratory have announced an R D partnership to expand US production of gallium. The new alliance will focus on developing the technologies needed to establish a domestic supply chain for an element that currently relies almost exclusively on imported… 04-06-2026

Fixing a Nintendo Game Boy Clone that Runs Too Fast

There s no shortage of cloned Nintendo hardware out there and most of it is pretty poor. A few are actually pretty interesting though such as the GB Boy by Gangfeng read… 04-06-2026

European Electronic Waste Dilemma

European electronic waste is being collected but the economics of recycling are complex. The post European Electronic Waste Dilemma appeared first on EE Times… 04-06-2026

Orbital Data Centers Are Souped-Up Satellites - For Now

Satellite constellations with extra onboard compute are several steps away from handling full AI workloads for people on Earth. The post Orbital Data Centers Are Souped-Up Satellites For Now appeared first on Semiconductor Engineering… 04-06-2026

Keeping Security Algorithms Current Is Getting Harder

As threats evolve faster protecting security algorithms from design through manufacturing and across the supply chain is becoming more difficult. The post Keeping Security Algorithms Current Is Getting Harder appeared first on Semiconductor Engineering… 04-06-2026

AI-Defined Vehicles Increase Pressure On Auto Ethernet Reliability

Time-sensitive networking and MACsec allow Auto Ethernet to handle safety-critical functions and enable real-time processing for AI-enabled features and agents. The post AI-Defined Vehicles Increase Pressure On Auto Ethernet Reliability appeared first on Semiconductor Engineering… 04-06-2026

Securing Terabit Ethernet For AI: Where MACsec IPsec And UET TSS Each Fit And Why You Need More Than One

Three protocols come together to form a coherent and scalable security architecture. The post Securing Terabit Ethernet For AI: Where MACsec IPsec And UET TSS Each Fit And Why You Need More Than One appeared first on Semiconductor Engineering… 04-06-2026

Breaking The Unhackable Xbox One

A hardware fault injection attack results in the first Xbox One boot ROM-level compromise after 12 years. The post Breaking The Unhackable Xbox One appeared first on Semiconductor Engineering… 04-06-2026

Beyond PCIe Compliance: Why Stress Testing Is Crucial For Edge AI Deployments

Replicate real-world operating conditions to determine how much margin there is and what happens when operating conditions begin to consume it. The post Beyond PCIe Compliance: Why Stress Testing Is Crucial For Edge AI Deployments appeared first on Semiconductor Engineering… 04-06-2026

Defending Smart Homes Against AI Cyber Attacks

How to mitigate the expected increase in vulnerability alerts software updates and breaches. The post Defending Smart Homes Against AI Cyber Attacks appeared first on Semiconductor Engineering… 04-06-2026

Delivering Automotive-Grade Quality With Customized FinFET Foundation IP

Reduce risk and improve outcomes during complex technology node transitions. The post Delivering Automotive-Grade Quality With Customized FinFET Foundation IP appeared first on Semiconductor Engineering… 04-06-2026

The Edge LLM Offload Story

Modern edge devices demand heterogeneous AI architectures that can mix and match subsystems to accelerate different aspects of inferencing. The post The Edge LLM Offload Story appeared first on Semiconductor Engineering… 04-06-2026

RISC-V And GPU Synergy In Practice: A Path Towards High-Performance SoCs

The ability to effectively combine compute AI and graphics will become a key differentiator for platform competitiveness. The post RISC-V And GPU Synergy In Practice: A Path Towards High-Performance SoCs appeared first on Semiconductor Engineering… 04-06-2026

The hidden bottleneck in LLM inference and the impact on MLPerf benchmarking

Here is how the prefill versus generation split exposes GPU structural inefficiencies in AI designs. The post The hidden bottleneck in LLM inference and the impact on MLPerf benchmarking appeared first on… 04-06-2026

Tessalia plans 250m packaging plant in France

Earlier this week Tessalia Technology.  a  packaging jv between Foxconn Radiall and Thales laid the foundation stone of  an advanced semiconductor packaging facility in Le Barp Nouvelle-Aquitaine. Patrice Caine Chairman ... The post Tessalia plans 250m packaging plant in France appeared first on Electronics Weekly… 04-06-2026