Caxapa

Анри Пуанкаре, 1854 год

Совместимость модуля DS-RK3568 от Диасом с российской операционный системой РЕД ОС: Подтвердили совместимость DS-RK3568 с операционной системой РЕД… 28-04-2026

Модули широкополосных источников света от Box Optronics: Компания Box Optronics запустила серийные поставки модулей широкополосных источников света BSLD-840-7SM-FA-M. 28-04-2026

Выгодное предложение Cнижение цен на импульсные источники питания Актаком: Сообщаем о значительном снижении цен на популярные модели импульсных источников питания Актаком APS-5310 30 В/10 А и APS-3020 30 В/20… 27-04-2026

Радифотоника от Cruetech. Оптоэлектронный модуль 10-100 МГц: Оптоэлектронный модуль 10 100 МГц Cruetech состоит из передатчика и приёмника. 23-04-2026

Скидка 15% на имульсные тестеры обмоток Актаком АМ-3085 и АМ-3083: Акция на импульсные высоковольтные тестеры обмоток Актаком продлена До 1 июня 2026 года со скидкой 15% можно приобрести не только АМ-3085 но и его младшего собрата -АМ-3083. 22-04-2026

Итоги выставки ExpoElectronica 2026: ключевые тренды и новинки РУ Электроникс: Компания РУ Электроникс приняла участие в 28-й международной выставке ExpoElectronica 2026 которая традиционно является ключевым отраслевым событием в сфере электронной промышленности. В рамках масштабной экспозиции был представлен широкий спектр линеек электронных компонентов RUICH I включая разъёмы дисплеи устройства коммутации клеммники конденсаторы тиристоры и многие другие.… 21-04-2026

Итоги выставки ExpoElectronica 2026: Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

True Anomaly raises 650m Series D for space-enabled intelligence: True Anomaly a defence space startup has raised 650 million of Series D financing. It provides for space-enabled intelligence for example precision navigation missile warning and communications systems. The round was ... The post True Anomaly raises 650m Series D for space-enabled intelligence appeared first on Electronics Weekly… 29-04-2026

Multiferroic Material Can Enable Low-Energy Computing: A redesigned crystal structure unlocks rare magnetic and electric behaviour hinting at alternative computing approaches beyond traditional silicon-based energy limitations. Researchers at Rice University have developed a modified multiferroic material that exhibits significantly enhanced performance at room temperature. Reported in Proceedings of the National Academy of Sciences the work… 29-04-2026

OpenLight secures 50m in Series A-1 funding boosting total raised to 84m: Photonic application-specific integrated circuit PASIC chip designer and manufacturer OpenLight of Goleta Santa Barbara CA USA which launched as an independent company in 2022 introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers modulators amplifiers and detectors has raised an additional 50m in a Series A-1 round. Including the … 29-04-2026

Iron Flow Battery Achieves Record Lifespan: A novel design reduces material loss inside the system producing results that challenge existing limits and suggest new directions for renewable energy storage. A research team from the Chinese Academy of Sciences has developed an all-iron flow battery designed to lower energy storage costs while extending operational lifespan. The study published in Advanced Energy… 29-04-2026

AI Data Centres Move Toward Unified Design: A unified approach brings thermal systems orchestration software and energy infrastructure together as AI workloads push data centres toward new limits. LG Electronics has presented its integrated cooling solutions for AI data centers at Data Center World 2026 in Washington D.C. The solutions are designed to address increasing thermal loads from AI and high-performance… 29-04-2026

Automotive Audio Bus Gets High Bandwidth Upgrade: A widely used in-vehicle network standard expands capabilities hinting at more complex audio systems without adding significant architectural overhead. Analog Devices has announced the production release of its A B 2.0 Automotive Audio Bus technology marking the next phase of its in-vehicle audio connectivity platform. Built on over a decade of adoption across more than… 29-04-2026

Wipeout Clone Runs Native on ESP32-S3: Psygnosis s 1995 game Wipeout is remembered for two things: being one of the greatest games of all time and taking advantage of the then-new PlayStation s capacity for 3D graphics. The ESP32-S3 read… 29-04-2026

PCIe 7.0 fundamentals: Baseline ordering rules: To maintain low latency and fully utilize PCIe 7.0 bandwidth under parallel workloads a more flexible ordering model is required. The post PCIe 7.0 fundamentals: Baseline ordering rules appeared first on… 29-04-2026

STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices: Introducing STM32C5 in India STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance memory and connectivity. The post STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices appeared first on EE Times… 29-04-2026

Assuring Comprehensive Security Coverage In Hardware Design: Security coverage is a key component of a systematic framework for comprehensive traceable security verification. The post Assuring Comprehensive Security Coverage In Hardware Design appeared first on Semiconductor Engineering… 29-04-2026

How Long Will CAN Stick Around As Rival Networks Speed Up: New in-vehicle networking technology will likely take over as more AI is added but in the near term designers face challenges integrating new with old. The post How Long Will CAN Stick Around As Rival Networks Speed Up appeared first on Semiconductor Engineering… 29-04-2026

Blog Review: Apr. 29: Interface IP in 3D SOCAMM in data centers edge intelligence implementations deposition etch for 3D interconnect telemetry design manufacturing collaboration. The post Blog Review: Apr. 29 appeared first on Semiconductor Engineering… 29-04-2026

From Silos to Systems from Data to Insight: Transform fragmented siloed data into a governed connected and reusable organizational knowledge base. The post From Silos to Systems from Data to Insight appeared first on Semiconductor Engineering… 29-04-2026

Building An AI Chip: Silicon Design And Advanced Packaging: The second key stage of AI chip design: silicon design and packaging. The post Building An AI Chip: Silicon Design And Advanced Packaging appeared first on Semiconductor Engineering… 29-04-2026

Three-Phase Supply For Automation: A new 3000W industrial power supply adds wide-range three-phase input support improving flexibility reliability and easier global deployment for automation semiconductor process control and manufacturing systems. A new industrial AC-DC power supply from TDK Corporation has entered the market featuring enhanced three-phase input capability targeting factories semiconductor tools… 29-04-2026

Wafer Platform Adds Hidden Defect Detection: A new wafer inspection platform combines AI analytics sub-micron imaging SWIR sensing and precision metrology to help semiconductor fabs improve yields and the quality of advanced packaging. A newly launched wafer inspection and metrology platform by Test Research Inc. TRI is targeting semiconductor fabs that need tighter defect control faster process feedback and higher… 29-04-2026

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