Моя конференция

Одноплатные компьютеры Orange Pi в портфеле поставок Макро Групп

Макро Групп расширила портфель поставляемой продукции включив в него одноплатные компьютеры Orange… 23-07-2026

АТЕ-9030: регистрация данных на SD-карту в реальном времени

АТЕ-9030 сочетает в себе функции точного шумомера и автономного регистратора данных. Прибор позволяет записывать результаты измерения на SD-карту в формате Excel без специального ПО просто подключите карту к компьютеру после измерений. 21-07-2026

Аналоги микросхем памяти SRAM европейских брендов от Chiplus

Компания Макро Групп расширяет линейку доступных аналогов для микросхем статической памяти. 20-07-2026

SiC-диод Шоттки в изолированном корпусе TO-247ISO-3 от AMG Power

AMG Power объявляет о выпуске кремниево-карбидного SiC диода Шоттки с номинальным напряжением 650 В и током 60 А в изолированном корпусе TO-247ISO-3 A3G60D650GT3Ci. 17-07-2026

АТЕ-5035 - сочетание простоты и инноваций для контроля температуры и влажности

Если вам необходимо контролировать влажность и температуру в производственном цехе или офисе обратите внимание на АКТАКОМ АТЕ-5035. Это решение для тех кому нужна мобильность лаборатории и запись результатов измерений без лишних посредников в виде установленного на ПК… 16-07-2026

Каталог Cosmo Ferrites 2026. Начало поставок материалов Ni-Zn и готовых магнитных компонентов

Компания Макро Групп представляет обновленный каталог продукции Cosmo Ferrites 2026 и сообщает о расширении ассортимента продукции доступной российским заказчикам. 16-07-2026

Дисплеи Tianma для промышленности медицины и транспорта

Компания Теллур Электроникс предлагает к поставке дисплеи Tianma одного из наиболее узнаваемых и востребованных брендов на российском рынке электронных компонентов. Tianma крупный производитель дисплейных решений основанный в городе Шэньчжэнь Китай. Компания занимает лидирующие позиции в отрасли и выпускает широкий ассортимент дисплеев для различных сфер применения. Дисплеи Tianma используют 16-07-2026

AXT adds Jia-Bin Duh to board

AXT Inc of Fremont CA USA which makes gallium arsenide GaAs indium phosphide InP and germanium Ge substrates and raw materials at plants in China has appointed Jia-Bin Duh to its board increasing the number of directors… 23-07-2026

Rad-hard GaN converters: Design insights for space hardware

Designing rad-hard GaN converters for aerospace applications is ultimately an exercise in managing extremes. The post Rad-hard GaN converters: Design insights for space hardware appeared first on… 23-07-2026

Voice Control Toolkit Comes to a Pico Near You

Voice-controlled appliances are nothing new. What might be new however is Moonshine AI running it all locally on a Raspberry Pi Pico 2 W The voice interface is roughly divided read… 23-07-2026

DAC 2026: Users Are Not Waiting DIY AI Is Now in Vogue

At DAC 2026 chip giants stop waiting for EDA vendors and build their own AI brains see who s seizing control. The post DAC 2026: Users Are Not Waiting DIY AI Is Now in Vogue appeared first on EE Times… 23-07-2026

Designing Electro-Optical Chips

Photonics is forcing EDA to verify not just chips but the physics of light inside full electro-optical systems. The post Designing Electro-Optical Chips appeared first on Semiconductor Engineering… 23-07-2026

Untangling Chip Traffic Jams

Scaling NoCs across chiplets requires earlier validation of coherency congestion thermal effects and fault behavior. The post Untangling Chip Traffic Jams appeared first on Semiconductor Engineering… 23-07-2026

Chip Policy: The UK Vs. The US Vs. EU Vs. India

Policy shifts affect every company in the semiconductor industry regardless of their size. The post Chip Policy: The UK Vs. The US Vs. EU Vs. India appeared first on Semiconductor Engineering… 23-07-2026

Realizing The Future Of 3D-IC: Final Scenario And Sign-off

Chiplet interface route planning optimization and predictive analysis are crucial for achieving PPAC goals. The post Realizing The Future Of 3D-IC: Final Scenario And Sign-off appeared first on Semiconductor Engineering… 23-07-2026

Avoid The Hidden Bottleneck Of Integration At Scale

Automating connectivity and establishing a single source of truth helps accelerate SoC assembly while improving design quality. The post Avoid The Hidden Bottleneck Of Integration At Scale appeared first on Semiconductor Engineering… 23-07-2026

From Future Vision To Running Hardware: Verification At DAC 2026

Last year DAC s Engineering Track debated where verification is headed. This year in Long Beach the emulation and prototyping hardware that will carry it takes center stage. The post From Future Vision To Running Hardware: Verification At DAC 2026 appeared first on Semiconductor Engineering… 23-07-2026

Why Chip Engineers Should Care About AI-Created Behavioral Models

Automating the most repetitive and time-consuming parts of behavioral model creation while keeping humans in the loop. The post Why Chip Engineers Should Care About AI-Created Behavioral Models appeared first on Semiconductor Engineering… 23-07-2026

Enhancing System Observability

Integrating real-time voltage telemetry and functional monitoring for deeper insights. The post Enhancing System Observability appeared first on Semiconductor Engineering… 23-07-2026

The End Of Physics Silos In Engineering AI

As systems become more advanced engineering intelligence cannot remain fragmented across isolated AI models that only understand narrow slices of physical behavior. The post The End Of Physics Silos In Engineering AI appeared first on Semiconductor Engineering… 23-07-2026

How Wireless Coexistence Testing Exposes Real-World Medical Device Behavior

Reduce patient risk and support regulatory readiness by demonstrating how a device performs in the presence of real world interference. The post How Wireless Coexistence Testing Exposes Real World Medical Device Behavior appeared first on Semiconductor Engineering… 23-07-2026

Using Reliability Degradation Parameters To Drive Better Design Choices

Translate stress and aging data into measurable design signals to determine if a circuit still meets reliability expectations. The post Using Reliability Degradation Parameters To Drive Better Design Choices appeared first on Semiconductor Engineering… 23-07-2026

Barclays joins fusion consortium

Barclays is supporting the UK Infinity Fusion Consortium a private sector-led collaboration to establish a commercial fusion power plant project in the UK. Barclays brings expertise in energy infrastructure project The post Barclays joins fusion consortium appeared first on Electronics Weekly… 23-07-2026