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Достоевский Достоевский, 1821 год
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IGBT-модуль 1200 В  50 А с низкими потерями переключения для сварочных инверторов от AMG Power IGBT-модуль 1200 В 50 А с низкими потерями переключения для сварочных инверторов от AMG Power
AMG Power начала серийные поставки IGBT-модуля 1200 В 50 А при температуре корпуса 80 C с низкими потерями переключения и встроенным быстрым обратным диодом FWD Free Wheeling Diode AMG50G1200BME2. 11-11-2026
8-дюймовые полуизолирующие SiC-подложки для мощных СВЧ-транзисторов от Qatron
Qatron объявил о поставках полуизолирующих подложек из карбида кремния SiC диаметром 200 мм 8 дюймов с удельным сопротивлением более 10 Ом… 11-11-2026
Новое поступление на склад РУ Электроникс: компоненты RUICHI и аналоги мировых брендов Новое поступление на склад РУ Электроникс: компоненты RUICHI и аналоги мировых брендов
РУ Электроникс пополняет склад электронными компонентами и электротехникой ожидается более 600 позиций комплектующих. Часть позиций уже доступна на складе остальные ожидаются в ближайшее время. Следите за актуальным статусом можно в файле catalog - arrivals . xlsx . В поступлении - продукция собственного бренда RUICHI и доступные аналоги западных производителей. Поможем подобрать электронику… 10-11-2026
Перестраиваемый волоконно-оптический фильтр с диапазоном перестройки до 80 нм от FIBERT
Компания FIBERT представила перестраиваемый волоконно-оптический фильтр с диапазоном перестройки длины волны до 80 нм разрешением от 0 02 нм и вносимыми потерями от 2 5 дБ серия FBRT-SMTOF. 09-11-2026
IGBT-модуль 1200 В 50 А с низкими потерями переключения для сварочных инверторов от AMG Power
AMG Power начала серийные поставки IGBT-модуля 1200 В 50 А при температуре корпуса 80 C с низкими потерями переключения и встроенным быстрым обратным диодом FWD Free Wheeling Diode AMG50G1200BME2. 06-11-2026
Микроконтроллер реального времени на ядре Arm Cortex-M52 для силовой электроники от Geehy
Geehy Semiconductor представила серию экономичных высокопроизводительных микроконтроллеров реального времени MCU/DSP на базе платформы G32R5 … 05-11-2026
Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с
Опубликован новый каталог оптических трансиверов Cruetech на 2026 год более 3000 моделей в 40 форм-факторах и исполнениях. 02-11-2026
Новый каталог оптических трансиверов Cruetech: 3000 моделей от DC до 800 Гбит/с
Макро Групп подготовила каталог оптических трансиверов бренда Cruetech на 2026 год более 3000 моделей в 40 форм-факторах и исполнениях. 02-11-2026
Buffett And The AI Boom
Last week s stock market sell-off led by Al and technology stocks after the midterms showed how nervous investors currently are with respect to the staying power of the Al boom. The post Buffett And The AI Boom appeared first on Electronics Weekly… 11-11-2026
WT to distribute Sivers InP lasers and wireless solutions
Sivers Semiconductors AB of Kista Sweden which supplies RF beam-former ICs and lasers for AI data-center SATCOM defense and telecom applications has announced a global distribution agreement with electronics and semiconductors distributor WT Microelectronics… 11-11-2026
Electronica: onsemi s EliteSiC M4 delivers higher power density and lower losses
onsemi claims its fourth-generation EliteSiC silicon carbide SiC platform delivers up to 30% higher power density and 35% lower losses than the previous generation. The EliteSiC M4 platform improves conduction The post Electronica: onsemi s EliteSiC M4 delivers higher power density and lower losses appeared first on Electronics Weekly… 11-11-2026
Why Engineers are Forced to Create Junk Designs Why Engineers are Forced to Create Junk Designs
It s become a bit of a platitude to state that products were manufactured better in the olden days but as The Meandrous Engineer covers in a recent video essay the read… 11-11-2026
Get Mannerisms Gadget Master the Daily and the Weekly in newsletter form
Let our content come straight to you Easily digestible newsletter emails straight to your inbox. And all the newsletters are mobile optimised. The post Get Mannerisms Gadget Master the Daily and the Weekly in newsletter form appeared first on Electronics Weekly… 11-11-2026
Electronica - The latest news roundup
Don t miss the Electronics Weekly roundup of all our latest news from Electronica the bi-annual event running from 10-13 November in Munich. Electronica is the world s biggest electronics show and Electronics The post Electronica The latest news roundup appeared first on Electronics Weekly… 11-11-2026
Nexperia expands SiC portfolio with 750V trench MOSFETs for high-efficiency power conversion
Discrete device designer and manufacturer Nexperia B.V. of Nijmegen the Netherlands which operates wafer fabs in Hamburg Germany and Hazel Grove Manchester UK has launched a new family of 750V silicon carbide SiC trench MOSFETs combining low switching losses temperature-stable RDS on characteristics and robust switching performance in a broad range of package options including… 11-11-2026
Electronica: Minew MG10 Bluetooth base station builds sub-meter indoor positioning
Minew is introducing the MG10 a Bluetooth AoA Angle of Arrival positioning base station supporting 0.1 to 1 meter accuracy. It is designed to enable high-precision indoor positioning in real-time The post Electronica: Minew MG10 Bluetooth base station builds sub-meter indoor positioning appeared first on Electronics Weekly… 11-11-2026
Diamond Foundry unveils first 200mm single-crystal diamond
Diamond Foundry Inc of San Francisco CA USA has unveiled the first 200mm-diameter single-crystal diamond. The announcement accompanied a keynote presentation by CEO Martin Roscheisen delivered by video at CarbonSemi 2026 the 6th Industry Development Summit of Carbon-based Semiconductor Devices in Ningbo China 5 7 November… 11-11-2026
Variable-Length Prompts on Chimera GPNPU
How a flexible binary can serve every length up to the capacity you set. The post Variable-Length Prompts on Chimera GPNPU appeared first on Semiconductor Engineering… 11-11-2026
UCIe Connectivity for 2.5D and 3D Multi-Die Designs
The differences and engineering considerations behind choosing and implementing UCIe connectivity for advanced multi-die designs. The post UCIe Connectivity for 2.5D and 3D Multi-Die Designs appeared first on Semiconductor Engineering… 11-11-2026
Blog Review: Nov. 11
Interconnects key in AI infrastructure floating nets mitigating Control Flow attacks PNT trends. The post Blog Review: Nov. 11 appeared first on Semiconductor Engineering… 11-11-2026
Google pairs TPU with Arm Neoverse
Google Cloud is pairing its TPU 8i Max system s with Arm-based Axion processors that are custom Arm Neoverse-based CPUs With TPU 8i Max Google is extending its use of Axion The post Google pairs TPU with Arm Neoverse appeared first on Electronics Weekly… 11-11-2026
Imec delivers baseline flows for NanoIC line interposer
Imec has delivered the baseline flows for the silicon interposer platform being developed within the NanoIC pilot line. Providing an early technical view of a key technology for chiplet integration The post Imec delivers baseline flows for NanoIC line interposer appeared first on Electronics Weekly… 11-11-2026
Electronica: TME showcases the Dual Brain Arduino VENTUNO Q
Distributor TME Transfer Multisort Elektronik showcased the Arduino VENTUNO Q at this year s electronica. The high-performance single-board computer SBC targets Edge AI robotics and real-time control applications reflecting the prominence The post Electronica: TME showcases the Dual Brain Arduino VENTUNO Q appeared first on Electronics Weekly… 11-11-2026
Electronica: Harwin launches XPi cable design and assembly service
Harwin the UK-based manufacturer of high-reliability interconnects has launched an integration services unit to support customers using its products in harsh environments and safety-critical applications. The unit called XPi will The post Electronica: Harwin launches XPi cable design and assembly service appeared first on Electronics Weekly… 11-11-2026