Caxapa

Блок питания 5 5 кВт с сертификацией 80 PLUS Ruby для ИИ-серверов от Compuware: Компания Compuware Technology представила серверный блок питания мощностью 5 5 кВт с сертификацией 80 PLUS Ruby CPR-5521-2M1. 07-10-2026

Полупроводниковый оптический усилитель 1064 нм усиление 13 дБ выходная мощность до 10 дБм от FIBERT: FIBERT представляет полупроводниковый оптический усилитель SOA на длину волны 1064 нм с малосигнальным усилением 13 дБ и выходной мощностью до 10 дБм серия FBRT-PISOA. 06-10-2026

Распродажа высоковольтных тестеров обмоток Актаком: До 31 декабря 2026 года действует специальная программа скидок на высоковольтные тестеры обмоток. С выгодой 15% можно приобрести популярные модели высоковольтных тестеров обмоток АМ-3083 до 3000 В и АМ-3085 до 5000… 05-10-2026

Группа Астра и ГК Макро Групп договорились о сотрудничестве в сфере встраиваемых решений: Одноплатные компьютеры PicoS и NanoS а также модули DIASOM будут работать на операционной системе Astra Linux… 02-10-2026

Группа Астра и ГК Макро Групп договорились о сотрудничестве в сфере встраиваемых решений: Одноплатные компьютеры PicoS и NanoS а также модули DIASOM будут работать на операционной системе Astra Linux… 02-10-2026

Топовые клеммные блоки Tianli на складе в Москве.: О компании Tianli: Азиатский лидер топ-уровня Компания Tianli была основана в 1998 году и за более чем 25 лет работы стала одним из ведущих азиатских производителей клеммных блоков. Штаб-квартира и производственные мощности расположены в зоне нового развития залива Ханчжоу Hangzhou Bay New Zone город Нинбо всего в 2 часах езды от Шанхая. Tianli имеет сертификаты... 02-10-2026

Срок действия акции на промышленные столы Актаком продлен: До 15 ноября 2026 года на большинство моделей промышленных столов Актаком со стандарной и антистатической ESD столешницей большинства модификаций предоставляется скидка 15% от розничной… 30-09-2026

700 Вт и 63% КПД: NEDITEK представил GaN-усилители Догерти для инфраструктуры 5G-Advanced: Компания NEDITEK объявила о выводе на международный рынок линейки высокомощных СВЧ-усилителей на основе нитрида галлия GaN выполненных по архитектуре Догерти с выходной мощностью до 700 Вт и PAE более… 29-09-2026

Wolfspeed receives conditional 1.5bn loan commitment from US Department of War: Wolfspeed Inc of Durham NC USA which makes silicon carbide SiC materials and power semiconductor devices has received a conditional loan commitment letter from the US Department of War DoW through its Office of Strategic Capital OSC for up to 1.5bn of long-term 30-year financing to support the domestic development and production of silicon carbide SiC materials and wide-bandgap 08-10-2026

2026 Retrocomputing Challenge: Retro Terminal Bartop Arcade Topper: Retrocomputing is more than just hardware. It s also a feel a vibe and valkyrie0528 s Retro Terminal Bartop Arcade Topper has it in spades. Here s how it happened. The gorgeous device read… 08-10-2026

India: Recognized for sustainability export excellence and innovation: TDK India has received awards from the Electronic Industries Association of India ELCINA in the areas of sustainability exports and technological innovation. 08-10-2026

Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing: Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R D footprint in India. The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times… 08-10-2026

Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging: How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow. The post Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging appeared first on Semiconductor Engineering… 08-10-2026

Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications: How optimized plasma processing can achieve effective surface roughening and activation. The post Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications appeared first on Semiconductor Engineering… 08-10-2026

Closing The Visibility Gap: More measurements don t eliminate blind spots when each view captures only part of the device. The post Closing The Visibility Gap appeared first on Semiconductor Engineering… 08-10-2026

Multilayer Inductors for Automotive Cameras: Multilayer inductors support automotive power-over-coax systems by reducing noise while carrying power and data through one cable in camera modules. TDK Corporation has expanded its MLJ1608-G series of multilayer inductors for automotive power-over-coax PoC circuits. Automotive PoC allows power and data to be transmitted through a single coaxial cable. The technology is mainly used… 08-10-2026

From Silicon To Systems: Redefining Competitive Advantage Part 3: The next generation of industry leaders may look very different from the last. The post From Silicon To Systems: Redefining Competitive Advantage Part 3 appeared first on Semiconductor Engineering… 08-10-2026

Shift Left Complicates Fab Data Management: Streaming sensor data creates new challenges for advanced process control. The post Shift Left Complicates Fab Data Management appeared first on Semiconductor Engineering… 08-10-2026

From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test: An integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies. The post From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test appeared first on Semiconductor Engineering… 08-10-2026

The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control: The next frontier in process control isn t just visual it s electrical. The post The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control appeared first on Semiconductor Engineering… 08-10-2026

CPO Testing Faces A Moving Target Problem: Test vendors are adapting to changing connector architectures and extreme alignment tolerances as co-packaged optics heads toward mainstream. The post CPO Testing Faces A Moving Target Problem appeared first on Semiconductor Engineering… 08-10-2026

Perspectives On Test: System Level Test For AI Data Centers: Testing every device under real-world conditions has never been more important. The post Perspectives On Test: System Level Test For AI Data Centers appeared first on Semiconductor Engineering… 08-10-2026

AI Flight Controller Adds Onboard Intelligence: A dual-core RISC-V flight controller integrates redundant sensing real-time control and onboard AI inference for fixed-wing aircraft multirotor drones and unmanned surface vessels. Upbeat Technology s Bluemag Pi is a sensor-integrated AI flight controller designed to combine flight-critical control and onboard AI processing on a single platform. The board is based on the UP301 system-on-chip 08-10-2026

Edge AI Agent Framework for IoT: AI tools help microcontroller-based devices respond to events make decisions access documentation and connect with smart home platforms. Espressif has introduced ESP-Claw a framework for ESP32 series microcontrollers that brings LLM-driven agent capabilities to connected devices. The framework supports event-driven responses LLM-based decision-making context retention and local actions.… 08-10-2026

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