Моя конференция

Модуль камеры DS-CAR0234-22 на базе сенсора ON Semi

Запустили серийное производство модуля камеры DS-CAR0234-22 на базе сенсора… 07-04-2026

Разъёмы JCDw аналоги ОНП-ЖИ СНП339

Теллур Электроникс предлагает малогабаритные низкочастотные прямоугольные соединители JCDw. Разъёмы соответствуют стандарту GJB2446A MIL-C-83513 предназначены для внутреннего монтажа и являются аналогом российских серий ОНП-ЖИ и СНП339. th td padding: 5px Аналог JCDw Российский артикул ОНП-ЖИ / СНП339 JCDw-21TJ-N1 ОНП-ЖИ-8-21/46х8-В38-1 / СНП339-21ВП118-1 JCDw-21ZK-N1Q ОНП-ЖИ-8-21/46х8-Р2 07-04-2026

SiC MOSFET на 1200 В 75 А 30 мОм в корпусе TOLT с верхним отводом тепла от AMG Power

AMG Power анонсировал начало массового производства карбид-кремниевых МОП-транзисторов транзисторов на 1200 В с сопротивлением 30 мОм в инновационном корпусе TOLT с конструкцией обеспечивающей отвод тепла через верхнюю поверхность. 06-04-2026

Цифровые осциллографы Актаком ADS-2000 доступны к поставке

С короткими сроками поставки можно приобрести цифровые осциллографы Актаком серии АDS-2000 которые включены в Государственный реестр средств измерений з а 49918-12… 06-04-2026

Высоколинейный LNB Ku-диапазона для задач спутниковой связи от Talent Microwave

Компания Talent Microwave представила высокопроизводительный LNB Ku-диапазона TLLNB13.75G15.25G-55-2. 06-04-2026

Одна линейка - 4 модуля камер Диасом под вашу задачу

В конце 2025 года мы расширили свое портфолио и запустили линейку модулей камер на базе сенсоров компании… 02-04-2026

Портативные осциллографы-мультиметры серии ADS-2000

Доступны к поставке все модели цифровых осциллографов-мультиметров серии ADS-2000 включенных в Госреестр СИ за номером… 01-04-2026

ACM Research unifies product portfolio as ACM Planetary Family

ACM Research Inc of Fremont CA USA which develops and manufactures processing equipment for semiconductor device and wafer- and panel-level packaging WLP applications has announced a new branding and organization of its product portfolio into a unified process-based structure referred to as the ACM Planetary… 07-04-2026

EW Video: In conversation with Densitron on the future of tactile interfaces

As part of our In Conversation With series we recently caught up with Densitron s Global Product Director Bazile Peter. He discusses emerging tactile interface technologies including haptic solutions transparent buttons ... The post EW Video: In conversation with Densitron on the future of tactile interfaces appeared first on Electronics Weekly… 07-04-2026

IVWorks raises 4.5m to expand reGaN technology into RF and AI power semi markets

IVWorks Co Ltd of Daejeon South Korea which was founded in 2011 and manufactures 100 200mm gallium nitride GaN epitaxial wafers for RF power electronics applications is accelerating its expansion into the GaN semiconductor market through its proprietary reGaN technology while continuing to expand its core epiwafer business across multiple advanced device platforms. Leveraging… 07-04-2026

Thin Board For Edge AI And Industrial Automation

Compact industrial motherboard integrates next-gen processors high-speed memory and rich I/O for AI-driven edge deployments. A new Thin Mini-ITX motherboard by Avalue Technology Inc. has entered the industrial computing space targeting advanced AI workloads and automation at the edge. Designed for compact embedded environments the board combines next-generation processing with high-bandwidth… 07-04-2026

EMC Components: TDK launches ultra-small noise suppression filters for audio lines with high noise attenuation in the 5-GHz band

TDK Corporation has announced its latest noise suppression filters of the MAF0603GWY series. These measure only 0.6 mm x 0.3 mm x 0.3 mm L x W x H for use in small consumer devices like smartphones and wearables. Mass production of the new product series is set to begin in April… 07-04-2026

934 MHz: When The Government Really Doesn t Want You To Have CB

In the mid 1970s there were a spate of movies depicting the romance and lifestyle of truck drivers in the southern half of the United States. Over on the other read… 07-04-2026

Star-Shaped Nanostructures Enable Hybrid Energy Storage

What if a material s shape could change how it stores energy Star-like nanostructures enable faster surface-driven storage with hybrid battery capacitor behaviour. Researchers at University at Buffalo have demonstrated how altering the shape of a nanomaterial can significantly change how it stores energy highlighting a new pathway for designing advanced energy storage systems. The study… 07-04-2026

Fungus Inspired Semiconductors For Flexible Electronics

Could pigments from fungi redefine electronics Scientists are uncovering organic materials that enable flexible light-responsive devices with unusual electronic behaviours. Researchers at Oregon State University are advancing organic semiconductor technologies inspired by nature pointing to a future of flexible low cost and potentially more sustainable electronic devices. Building… 07-04-2026

Bio-Hybrid DNA Memristors for Energy-Efficient Data Storage

By embedding synthetic DNA into electronic architectures researchers unlock a class of memory devices capable of simultaneous processing and storage. Researchers at Penn State University have developed a bio inspired approach to next generation data storage by integrating synthetic DNA with semiconductor materials opening the door to memory devices that combine ultra high capacity… 07-04-2026

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS Co-Packaged Optics And More

Staying inside increasingly narrow process windows as specialty devices scale diversify and enter high-volume production. The post The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS Co-Packaged Optics And More appeared first on Semiconductor Engineering… 07-04-2026

Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time

Deploying AI on top of fragmented siloed inconsistently formatted data produces fragmented unreliable results. The post Breaking The Legacy Trap: How Semiconductor Executives Can Accelerate AI Adoption And Transform IT Applications At The Same Time appeared first on Semiconductor Engineering… 07-04-2026

Enhancing Silicon Reliability With In-System Test And SLM Data

A convergence of DFT techniques and the proliferation of in-silicon monitors can flag potential failures before they occur. The post Enhancing Silicon Reliability With In-System Test And SLM Data appeared first on Semiconductor Engineering… 07-04-2026

AI data Center Providers Seek Power and Bandwidth Promise in CPO

Insights on implementing a test strategy from bench validation to high-volume that enables a seamless path to scale. The post AI data Center Providers Seek Power and Bandwidth Promise in CPO appeared first on Semiconductor Engineering… 07-04-2026

Mid-infrared Ellipsometry For Optical Critical Dimension Metrology

Mid-infrared ellipsometry enabled by tunable quantum cascade lasers and polarization modulation offers a transformative approach to optical critical dimension metrology for advanced semiconductor structures. The post Mid-infrared Ellipsometry For Optical Critical Dimension Metrology appeared first on Semiconductor Engineering… 07-04-2026

AI Accelerators Usher In New Era Of Semiconductor Test

The number and variety of test interfaces coupled with increased packaging complexity are creating an explosion of testing challenges. The post AI Accelerators Usher In New Era Of Semiconductor Test appeared first on Semiconductor Engineering… 07-04-2026

Untrusted Analog Components Add Risks For Critical Infrastructure

Suggested alternative: Identifying counterfeits requires adding certificate processes increasing equipment investments and a lot more coordination. The post Untrusted Analog Components Add Risks For Critical Infrastructure appeared first on Semiconductor Engineering… 07-04-2026