Схемы, платы, компоненты

Итоги выставки ExpoElectronica 2026

Компания Теллур Электроникс приняла участие в международной выставке ExpoElectronica 2026 которая традиционно является одной из ключевых площадок для демонстрации достижений в области электронной промышленности. В рамках мероприятия наша команда представила актуальные решения и продукцию по направлениям электромеханики микроэлектроники СВЧ датчиков дисплеев и отечественной элементной базы.… 21-04-2026

SDR модули CR-P047/CR-P047P от Cruetech

Макро Групп предлагает SDR модули CR-P047 и CR-P047P под брендом… 20-04-2026

Промышленные eMMC NAND и DDR ИС и модули от Cruetech для встраиваемых систем

Cruetech продолжает укреплять своё предложение высоконадежной памяти для промышленных и коммерческих встраиваемых решений. 17-04-2026

Промышленные столы Актаком АРМ-4х1х с антистатической столешницей. Скидка 15%

Информируем о продлении акции на промышленные столы АКТАКОМ АРМ-4х1х с антистатической ESD-столешницей в рамках которой действует скидка 15% от розничной цены. Новый срок действия - до 01 июня 2026… 16-04-2026

Автомобильный дискретный IGBT на 1200 В от Sunco

Компания Sunco производитель силовой электроники анонсировала новое поколение дискретных автомобильных IGBT-транзисторов напряжением 1200 В в корпусе… 15-04-2026

Аналоговые и mixed-signal ИС для промышленной автомобильной и потребительской электроники от NOVOSENSE Microelectronics

Компания Макро Групп начала сотрудничество с производителем высоконадёжных аналоговых и mixed-signal микросхем для промышленной автомобильной и потребительской электроники NOVOSENSE Microelectronics. 13-04-2026

Развитие направления гражданских БПЛА: решения от Теллур Электроникс

Компания Теллур Электроникс приглашает ознакомиться с новой специализированной страницей посвящённой решениям для разработки и производства гражданских беспилотных летательных аппаратов. В условиях стремительного роста рынка БПЛА и задач импортозамещения мы системно расширяем портфель электронных компонентов и модулей востребованных в таких областях как: мониторинг и безопасность сельское… 13-04-2026

The Changing ASICs Landscape: the Shift Toward Chip Disaggregation

ASIC design shifts to modular multi-die systems to beat AI-driven complexity. The post The Changing ASICs Landscape: the Shift Toward Chip Disaggregation appeared first on EE Times… 21-04-2026

Chip Industry Technical Paper Roundup: Apr. 21

Neural computers AFM on EUV nanostructures photonic chip packaging extreme-environment photonics SSD emulation for GPU-centric storage ruthenium interconnects DRAM power delivery on CIM silent data corruption LLM training reliability GPU Rowhammer privilege escalation The post Chip Industry Technical Paper Roundup: Apr. 21 appeared first on Semiconductor Engineering… 21-04-2026

Research Bits: Apr. 21

Compute-in-memory: State space models ultra-thin AlScN memory brain-inspired edge AI. The post Research Bits: Apr. 21 appeared first on Semiconductor Engineering… 21-04-2026

Growing ultra-thin magnetic materials on wafers

Researchers grow magnetic materials on wafer-scale surfaces moving beyond flakes and enabling use in spin-based devices sensors and data storage systems. Researchers from the Indian Institute of Science have found a way to grow ultra-thin magnetic materials across centimetre-scale wafers addressing a key limitation that has kept these materials confined to lab experiments. These… 21-04-2026

Reducing Complexity in Chip Design

Chip design takes years large teams and iterations. A new approach uses AI to handle decisions reduce effort and speed up development across the system. Tattvam AI is being built to fundamentally reduce the complexity of chip design enable faster development cycles and make it possible to design the growing range of silicon… 21-04-2026

Improved tools for design and analysis

A design update brings simulation workflows and support across RF digital power quantum and photonics changing how systems are built and tested. Keysight Technologies has released ADS 2026 with updates across circuit simulation EM analysis electrothermal workflows layout and verification. The platform continues to support RF microwave high-speed digital power electronics quantum… 21-04-2026

  Treat the Antenna Gap as Design Space Not Wasted Space. - Dr K. Mithra

As 5G networks densify and massive MIMO scales antenna engineers face persistent mutual coupling in compact arrays. Dr K. Mithra   an Arizona-based independent wireless researcher and inventor explains to EFY s Akanksha Sondhi Gaur how reengineering the inter-element gap rather than increasing spacing. Q. What inspired you to focus on mutual coupling reduction in microstrip… 21-04-2026

Faster Way to Finish Chip Design

A chip design approach brings heat power and signal checks earlier in the process helping find issues reduce rework and improve performance and reliability. Synopsys has introduced Multiphysics Fusion technology bringing Ansys golden multiphysics engines into its EDA tools to address chip design issues linked to electromagnetics thermal and mechanical effects. The first… 21-04-2026

German Chancellor and Siemens CEO slam EU AI regulation

German Chancellor Friedrich Merz and Siemens CEO Roland Busch pictured criticised the EU s approach to regulating industrial AI in speeches at the Hanover Fair. Busch told Bloomberg that most of ... The post German Chancellor and Siemens CEO slam EU AI regulation appeared first on Electronics Weekly… 21-04-2026

Cook steps down as Apple CEO

Yesterday Tim Cook CEO of Apple said would hand over to John Ternus pictured in September and take on the role of executive chairman. Cook has been CEO for 15 ... The post Cook steps down as Apple CEO appeared first on Electronics Weekly… 21-04-2026

Fraunhofer introduces LiFi Grathus

Fraunhofer is introducing Li-Fi Grathus which transmits data via light instead of cable or radio waves. The system delivers gigabit-speed performance and can send and receive data simultaneously. It operates ... The post Fraunhofer introduces LiFi Grathus appeared first on Electronics Weekly… 21-04-2026

Samsung picks up Mercedes battery deal to add to VW and BMW

Samsung s battery company Samsung SDI has won a contract to supply EV batteries to  Mercedes giving it a clean sweep of Germany s biggest car-makers Mercedes BMW and VW. Under the ... The post Samsung picks up Mercedes battery deal to add to VW and BMW appeared first on Electronics Weekly… 21-04-2026

AI optical transceiver market up 57% YoY

The  global market for AI-focused optical transceivers grew 57% last year  from 16.5 billion in 2025 to 26 billion in 2026 says TrendForce. Demand is rising sharply for 800G and ... The post AI optical transceiver market up 57% YoY appeared first on Electronics Weekly… 21-04-2026

Cyberdeck Build Gets Closer To Regular Laptop Than Most

Cyberdecks are typically reminiscent of weird computers in futuristic sci-fi films moreso than the computers of today. The cool thing about cyberdecks though is you get to build them however read… 21-04-2026

Designing a Digital-controlled PFC

Digital-controlled PFC improves efficiency reduces THD and enables advanced control in totem-pole AC/DC power supplies systems. The post Designing a Digital-controlled PFC appeared first on EDN Asia… 21-04-2026

Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year

Infineon leads the automotive semiconductor market in 2025 extending its dominance across regions and MCU segment growth globally. The post Infineon Retains Top Automotive Chip Supplier Position for 6th Consecutive Year appeared first on EDN Asia… 21-04-2026