Кибернетика, автоматика, протоколы

Разъёмы Y50 по стандартам GJB598A-96 GJB101A-97 для ответственных применений

Теллур Электроникс начала поставки цилиндрических соединителей серии Y50 соответствующих китайским военным стандартам GJB598A-96 GJB101A-97 . Разъемам характерны быстрое соединение байонет 1/4 оборота малые вес и размеры высокая плотность контактов значительная устойчивость к вибрации к солевому туману и влаге. Выводы разъёмов предназначены под пайку. Серия Y50 имеет следующие варианты: 19-02-2026

Фотодиодные усиленные приёмники PDA-серии от Thorlabs

Компания Thorlabs предлагает линейку фотодиодных усиленных приёмников PDA-серии представляющих собой готовое решение для регистрации оптического излучения в лабораторных и R D-приложениях. 19-02-2026

Комбинированные осциллографы Актаком 7 в 1 доступны к поставке

Доступны к быстрой поставке двух и четырехканальные модели комбинированных осциллографов Актаком 7 в 1 с полосой пропускания 350 и 500 МГц. Приборы включены в Госреестр СИ РФ за номером… 18-02-2026

Актуальная ситуация на рынке памяти в январе-феврале 2026 года от Cruetech

По данным аналитики Cruetech ценовой тренд на индустриальные SSD твердотельные накопители и DRAM-модули сохраняет восходящую динамику и по всей видимости продолжится в течение первого квартала 2026… 18-02-2026

Отладочная плата CRX7Z100 на базе Zynq7000 от Cruetech. Вебинар

Компания Макро Групп центр компетенций по применению ПЛИС и СнК приглашает на вебинар Отладочная плата CRX7Z100 на базе Zynq7000 от торговой марки Cruetech… 18-02-2026

Выставка ЭКСПОЭЛЕКТРОНИКА 2026 в Крокус Экспо 14-16 Апреля 2026

Компания РАДИОТЕХ примет участие в 28-й Международной выставке электроники ExpoElectronica 2026 которая пройдёт с 14 по 16 апреля 2026 года в Московском выставочном центре Крокус Экспо Павильон 3 . На стенде компании посетители выставки смогут: - Ознакомиться с новинками поставляемой продукции - Получить консультации технических специалистов по подбору компонентов для различных... 16-02-2026

Процессор для AIoT применения от Rockchip

Процессор для AIoT RK3562 от Rockchip получил награду Продукт с выдающимися рыночными показателями… 16-02-2026

Дешевле до 50% Монтажные наконечники для паяльных станций Актаком

Снижаем цены до 50% на самые популярные модели наконечников и наконечников-картриджей применяемых в монтажных паяльных станциях Актаком. 13-02-2026

AC Arc Fault Detection Reference Design For Circuit Breakers

Arc faults can pose a serious threat to electrical safety but detecting them can be challenging. This reference design integrates fast current sensing voltage monitoring and AI-powered detection to simplify development for circuit breakers. Residential and commercial circuit breakers face three major challenges: detecting arc faults reliably reducing false trips and speeding up product… 24-02-2026

PXI Express Platforms For Semiconductor Testing

As semiconductor testing grows more complex PXI Express platforms can bring changes at both the measurement channel and system architecture levels. ADLINK Technology has introduced two new PXI Express platforms the PXIe 9908 Source Measurement Unit and the PXES 2596 chassis aimed at semiconductor and electronic test and measurement applications. The additions expand… 24-02-2026

Chip Industry Technical Paper Roundup: Feb. 24

Carrier mapping in sub 2nm CNN-to-edge HLS sandpaper for atomic-precision surface finishing LLM chip design education nanolaser with extreme dielectric confinement germanium-tin alloy semiconductors low-voltage nanoscale MoS2 memristors scaling routers with in-package optics and HBM4 RISC-V security. The post Chip Industry Technical Paper Roundup: Feb. 24 appeared first on Semiconductor… 24-02-2026

Research Bits: Feb. 24

Growing patterned diamond thermal constraint for ferroelectrics improved microLEDs. The post Research Bits: Feb. 24 appeared first on Semiconductor Engineering… 24-02-2026

Chiplets 2026: Where Are We Today

Compelling reasons for using chiplets at the leading edge. The post Chiplets 2026: Where Are We Today appeared first on Semiconductor Engineering… 24-02-2026

Ultrafast Laser Filamentation Dictates Energy Deposition in Narrow-Gap Semiconductors

A new technical paper Extreme optical nonlinearities unveiled by ultrafast laser filamentation in semiconductors was published by researchers at Abbe Center of Photonics Laboratoire Hubert Curien et al. Abstract Sky-high optical nonlinearities make semiconductors ideal platforms for multifunctional photonic devices. The fabrication of such complex devices could greatly benefit from… 24-02-2026

Semidynamics Becomes 3-nm Ready Moves Europe Toward Hardware Sovereignty

Semidynamics powers Europe s AI future with 3-nm readiness and sovereign RISC-V hardware. The post Semidynamics Becomes 3-nm Ready Moves Europe Toward Hardware Sovereignty appeared first on EE Times… 24-02-2026

AI Tool For Faster PCB Part Creation

An AI tool converts component datasheets into symbols footprints and 3D models in minutes saving time reducing errors and avoiding library work. PCBPartz is live with more than 13 million IPC-7351 verified components and it has now taken a further step with the launch of AI Symbol Expert. The new AI tool automates… 24-02-2026

ASML 1000W light source to deliver 330wph EUV processing by 2030

ASML has developed a 1000W light source which should increase the throughput of its high-NA EUV machine from 220wph to 330wph by 2030. The advance has been achieved by doubling ... The post ASML 1000W light source to deliver 330wph EUV processing by 2030 appeared first on Electronics Weekly… 24-02-2026

Compound semi substrate market growing at 14% CAGR

The compound semiconductor substrate and open epiwafer markets are projected to reach almost 5.2 billion in total by 2031 growing at around 14% CAGR. Automotive electrification drives SiC substrates RF ... The post Compound semi substrate market growing at 14% CAGR appeared first on Electronics Weekly… 24-02-2026

Teledyne digitiser delivers 14Gbyte/s data transfer

Teledyne SP Devices ADQ35  is engineered for use in areas such as swept source optical coherence tomography SS OCT time of flight mass spectrometry distributed fiber-optic sensing LiDAR scientific instrumentation ... The post Teledyne digitiser delivers 14Gbyte/s data transfer appeared first on Electronics Weekly… 24-02-2026

Socionext and Innatera develop always-on human detection device

 Socionext and Innatera have developed a human-presence detection device that combines 60 GHz FMCW radar sensing with neuromorphic edge AI to deliver always-on detection with low power consumption. The chip ... The post Socionext and Innatera develop always-on human detection device appeared first on Electronics Weekly… 24-02-2026

Large-Board Rework Platform For High-Density Assemblies

Enhanced thermal control and precision alignment address growing complexity in advanced PCB repair and rework applications. As board designs grow in size and component density rework processes are under increasing pressure to deliver precision without compromising throughput. A new XL-format rework system by Kurtz Ersa was introduced to address exactly that challengebringing expanded heating… 24-02-2026

Fictiv and MISUMI report highlights AI and onshoring priorities

Fictiv and MISUMI Global released the 11th Annual State of Manufacturing Supply Chain Report based on a survey of more than 300 senior supply chain and manufacturing leaders. The report describes an industry managing ongoing volatility and changing how products are designed sourced and built. The 2026 report points to increased use of AI The post Fictiv and MISUMI report highlights AI… 24-02-2026

Amphenol RF adds Mini-FAKRA connectors

Amphenol RF has introduced USCAR compliant Mini-FAKRA connectors into its portfolio of RF interconnect for  vehicle designs. This multi-port connector is available in a variety of PCB and cable-mount configurations ... The post Amphenol RF adds Mini-FAKRA connectors appeared first on Electronics Weekly… 24-02-2026

16-Zone Reflow Platform Targets Higher Thermal Stability 

Advanced convection architecture and smart power control aim to raise profiling precision while cutting operating costs in high-mix SMT lines. A new 16-zone reflow oven configuration by Kurtz Ersa  is positioning itself as a high-performance option for electronics manufacturers seeking tighter thermal control and improved process efficiency in surface-mount production. The HOTFLOW THREE platform… 24-02-2026