Микроконтроллеры PIC

SDR модули CR-P401D и CR-P501D от Cruetech

Компания Макро Групп предлагает SDR модули от бренда Cruetech CR-P401D… 18-03-2026

SDR модули CR-P401D и CR-P501D от Cruetech

Компания Макро Групп предлагает SDR модули на базе СнК Zynq MP-SOC от бренда Cruetech CR-P401D… 18-03-2026

DIASOM на выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ

DIASOM представил свою продукцию на международной выставке АВТОМАТИЗАЦИЯ. ЭЛЕКТРОНИКА. ЭЛЕКТРОТЕХ. СВЕТ 17 19 марта 2026 года в Минске. 17-03-2026

Промышленные столы Актаком с ESD столешницей

Предлагаем к поставке различные разновидности промышленных столов Актаком с ESD столешницей. Уже сейчас в наличии имеются столы с антистатическими столешницами 100 и 150 см с цветовым исполнением каркаса RAL-8017 и RAL-9006 с минимальными сроками изготовления можно заказать столы со столешницей… 17-03-2026

Приглашаем посетить наш стенд на выставке ExpoElectronica 2026

Уважаемые клиенты и партнеры Приглашаем вас посетить наш стенд на международной выставке ExpoElectronica 2026 которая пройдет в Москве в МВЦ Крокус Экспо с 14 по 16 апреля. ExpoElectronica является крупнейшей выставкой электронной отрасли в Евразии объединяющей производителей поставщиков и разработчиков электронных компонентов и технологий. На нашем стенде C5061 вы сможете ознакомиться… 16-03-2026

Новинка Ремонтный паяльный комплекс Актаком ASE-4213

Представляем новый ремонтный паяльный комплекс Актаком ASE-4213 который совмещает в одном корпусе два независимых канала: радиомонтажный мощностью 70 Вт и термовоздушный с максимальной мощностью 1280… 16-03-2026

Герметичные разъемы на основе сплава КОВАР от SUNKYE

SUNKYE представила герметичные разъемы на основе сплава КОВАР 4J29 и 4J50… 16-03-2026

Разъем USB 4.0 Type-C со скоростью до 40 Гбит/с от компании OUPIIN

Компания OUPIIN выпустила разъем USB 4.0 Type-C серии 8976 с поддержкой скорости передачи данных до 40 Гбит/с. 16-03-2026

Power Chip That Makes Systems Smaller and Faster

A new power device could change how high voltage systems are designed by simplifying architectures reducing cost and replacing existing approaches. Wolfspeed has announced the industry s first commercially available 10 kV silicon carbide SiC power MOSFET. It is aimed at high-voltage systems where it enables more flexible system design improves durability and supports reliable… 19-03-2026

Platform Targets Real-World AI Bottlenecks

A new emulation system focuses on validating AI infrastructure under realistic workloads helping operators optimise performance before deployment. As AI adoption shifts from model training to real-world deployment a newly launched platform from Keysight Technologies aims to solve one of the industry s biggest challenges: validating and optimising inference performance at scale. The system… 19-03-2026

Ultra-Low Power Kit for Presence Sensing

The presence detection kit helps devices use less power work in crowded signals and makes it easier to build and launch connected products quickly. SPARK Microsystems has announced a new presence detection kit PDK that enables designers to overcome the limitations of legacy wireless connectivity for next-generation smart devices with advanced presence detection capabilities. Presence-aware 19-03-2026

400G Photonics Integration Progress

New TGV-based board advances high-speed optical engine testing OpenLight and Suzhou TFC Optical Communication have advanced silicon photonics back-end integration with a new evaluation platform supporting data rates up to 400G signalling continued progress in scaling optical interconnect performance for next-generation networks. At the centre of the development is the OLP-PM13306 evaluation… 19-03-2026

Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages

Closing the gap between warpage simulation results and actual measurement data. The post Quantifying The Impact Of Gravity On Strip Warpage Across Assembly Stages appeared first on Semiconductor Engineering… 19-03-2026

Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography Patterning 2026

High NA EUV s reduced field size is driving new innovation in optical proximity correction and mask synthesis. The post Exploring The Frontiers Of Lithography And Patterning: Highlights From SPIE Advanced Lithography Patterning 2026 appeared first on Semiconductor Engineering… 19-03-2026

Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles

Matching a simulated device to its real-world counterpart with sub-nanometer accuracy. The post Process Model Precision: Calibrating For Accurate Predictions Of FinFET Device Profiles appeared first on Semiconductor Engineering… 19-03-2026

Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration

Co-packaged optics face scaling challenges such as bandwidth density mismatches assembly complexity and the need for precise fiber alignment. The post Scaling AI Infrastructure: Overcoming Interconnect Bottlenecks Via CPO And Heterogeneous Integration appeared first on Semiconductor Engineering… 19-03-2026

Liquid Cooling Drives Other Localized Cooling

Chips that didn t need cooling may require it now. The post Liquid Cooling Drives Other Localized Cooling appeared first on Semiconductor Engineering… 19-03-2026

2D Semiconductors Inch Forward

Progress is steady but fundamental questions remain. The post 2D Semiconductors Inch Forward appeared first on Semiconductor Engineering… 19-03-2026

Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026

Using AI to transform semiconductor operations which in turn advances the next generation of AI systems. The post Aligning The Semiconductor Value Chain In A Virtuous AI Cycle At SEMICON Korea 2026 appeared first on Semiconductor Engineering… 19-03-2026

Advanced Packaging Limits Come Into Focus

Mechanical and process control limits are now shaping what can be manufactured at scale. The post Advanced Packaging Limits Come Into Focus appeared first on Semiconductor Engineering… 19-03-2026

Integrated Platform Advances Photonics Testing

An integrated optoelectronic system aims to streamline high-volume testing for next-gen AI-driven data centre interconnects. A new automated test platform from Teradyne Inc. targets one of the biggest bottlenecks in silicon photonics SiPh and co-packaged optics CPO : scaling production without sacrificing test coverage or efficiency. The system combines optical and electrical test capabilities 19-03-2026

Space Grade Choke In GaN/SiC Power Designs

A rugged surface-mount solution brings high-frequency noise suppression and reliability to next-gen aerospace and defense power systems. A new space-grade common mode choke has been introduced by Vishay Intertechnology Inc. to address electromagnetic interference EMI in high-speed switching environments particularly those using GaN and SiC technologies. Designed for aerospace defense … 19-03-2026

Satellite Cellular and WiFi in a Single IoT Module

One module keeps devices online by switching between WiFi cellular and satellite on its own with no contracts and no extra hardware for use across locations. Blues has launched Notecard for Skylo a module that gives devices cloud connectivity through satellite cellular and WiFi without requiring satellite subscriptions or long-term contracts. The module automatically switches… 19-03-2026

GPS alternative pioneer raises 83m

Advanced Navigation which provides an alternative to GPS  has raised 83 million in a Series C funding round. The round was led by Airtree Ventures with strategic participation from ... The post GPS alternative pioneer raises 83m appeared first on Electronics Weekly… 19-03-2026